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IR2304(S)&(PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions.
Symbol
V S
V B
V HO
V CC
V LO
V IN
Com
dV S /dt
Definition
High side offset voltage
High side floating supply voltage
High side floating output voltage HO
Low side and logic fixed supply voltage
Low side output voltage LO
Logic input voltage (HIN, LIN)
Logic ground
Allowable offset voltage SLEW RATE
Min.
V B - 25
-0.3
V S - 0.3
-0.3
-0.3
-0.3
V CC -25
—
Max.
V B + 0.3
625
V B + 0.3
25
V CC + 0.3
V CC + 0.3
V CC + 0.3
50
Units
V
V/ns
P D
Rth JA
T J
T S
T L
Package power dissipation @ T A ≤ +25 ° C
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
8-Lead SOIC
8-Lead PDIP
8-Lead SOIC
8-Lead PDIP
—
—
—
—
—
-50
—
0.625
1.0
200
125
150
150
300
W
° C/W
° C
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V S offset rating is tested with all supplies biased at 15V differential.
Symbol
V B
V S
V HO
V LO
V IN
V CC
T A
Definition
High side floating supply voltage
High side floating supply offset voltage
High side (HO) output voltage
Low side (LO) output voltage
Logic input voltage (HIN, LIN)
Low side supply voltage
Ambient temperature
Min.
V S + 10
Note 1
V S
COM
COM
10
-40
Max.
V S + 20
600
V B
V CC
V CC
20
125
Units
V
°C
Note 1: Logic operational for V S of COM -5 to COM +600V. Logic state held for V S of COM -5V to COM -V BS .
2
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